Rudolph Technologies to Participate in 9th Annual CEO Investor Summit 2017
WILMINGTON, Mass.–(BUSINESS WIRE)–Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process
characterization equipment, lithography equipment and software for wafer
fabs and advanced packaging facilities, announced that management will
participate in the 9th Annual CEO Investor Summit, taking
place Wednesday July 12, 2017 in San Francisco, CA.
The CEO Summit is an accredited investor and publishing research analyst
event held concurrently with SEMICON® West and Intersolar
2017 in San Francisco. The event is hosted by executive management from
participating companies and will feature a “round-robin” format
consisting of small group meetings, each 30 minutes in duration. During
the event, investors and analysts will have the opportunity to meet with
up to 10 of the 18 management teams during the 30-minute group meeting
sessions, as well as opportunities to meet with additional management
teams during the breakfast and lunch networking sessions.
The CEO Investor Summit is by invitation only and is open to accredited
investors and publishing research analysts. As space is limited, please
RSVP early. Hosts reserve the right to limit attendance as necessary.
While held concurrently with SEMICON West and Intersolar 2017, the event
is not affiliated with the show.
RSVP Contacts for 9th Annual CEO Summit 2017
To
RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.
Laura J. Guerrant-Oiye | Claire E. McAdams | |||
Guerrant Associates | Headgate Partners LLC | |||
Phone: (808) 960-2642 | Phone: (530) 265-9899 | |||
Email: [email protected] |
Email: [email protected] |
|||
The presentation materials utilized during the conference will be made
accessible on the investor page of Rudolph Technologies’ website at www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, lithography, process control metrology, and process control
software used by semiconductor and advanced packaging device
manufacturers worldwide. Rudolph delivers comprehensive solutions
throughout the fab with its families of proprietary products that
provide critical yield-enhancing information, enabling microelectronic
device manufacturers to drive down costs and time to market of their
devices. Headquartered in Wilmington, Massachusetts, Rudolph supports
its customers with a worldwide sales and service organization.
Additional information can be found on the Company’s website at www.rudolphtech.com.
Contacts
Investors:
Rudolph Technologies, Inc.
Steven R. Roth,
973-448-4302
Senior Vice President & CFO
[email protected]
or
Guerrant
Associates
Laura Guerrant-Oiye, 808-960-2642
Principal
[email protected]