Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

For substrates up to 480mm during semiconductor packaging

CONCORD, Calif.–(BUSINESS WIRE)–Nordson
MARCH, a Nordson company (NASDAQ:NDSN),
a global leader in plasma processing technology, introduces the
MesoSPHERE™ Plasma System for very-high throughput processing of 3D and
wafer-level packaging processes such as fan-in, fan-out, wafer-level,
and panel-level – handling wafers up to 450mm and panels up to 480mm.
The MesoSPHERE’s new, patented W3 three-axis symmetrical plasma chamber
ensures that all areas of the wafer are treated equally and uniformly.
Tight control over all process parameters gives highly repeatable
results.

For wafer cleaning, the MesoSPHERE plasma system removes contamination
prior to wafer bumping, organic contamination, fluorine and other
halogen contamination, and metal and metal oxides. Plasma improves
spun-on film adhesion and cleans metallic bond pads.

For wafer etching, the MesoSPHERE plasma system descums wafers of
residual photoresist and BCB, pattern dielectric layers for
redistribution, strip/etch photoresist, enhances adhesion of wafer
applied materials, removes excess wafer applied mold /epoxy, enhances
adhesion of gold solder bumps, destresses wafer to reduce breakage,
improves spun-on film adhesion, and cleans aluminum bond pads.

The MesoSPHERE’s chamber design and control architecture enable short
plasma cycle times with very low overhead, maximizing throughput and
minimizing cost of ownership. Plasma confinement technology uses a ring
to isolate and focus plasma so it’s distributed directly above the
wafer, minimizing undesired secondary reactions. Process temperatures
can be kept low because the ring increases etch rate capability without
increasing the electrode temperature or adding bias to the chuck.

An innovative handling system transfers round or square substrates and
frame or bonded carriers. The modular design allows capacity increase on
a per plasma chamber basis. Equipment front end module (EFEM)
integration supports from 1 to 4 plasma chambers. A pocket chuck design
provides accurate substrate placement and centering, for additional
process repeatability.

“A unique feature of the MesoSPHERE is the way we developed the
isolation,” explained Jonathan Doan, director of marketing for Nordson
MARCH. “It allows our customers a method to perform advanced packaging
without having to use an expensive carrier and it can be used with 300mm
wafers on frames.”

See the MesoSPHERE at SEMICON China booths 3137 and 3231. For more
information, contact Nordson MARCH at [email protected]
or visit the website at www.nordsonmarch.com.

Photo Available at: http://www.nordson.com/~/media/Images/Nordson/march/PR-High-Resolution/NordsonMarch-MesoSPHERE-Plasma-Treatment

About Nordson MARCH

Nordson MARCH designs and manufactures a complete line of award-winning
and patented plasma treatment systems that improve product reliability
and increase production yields. Delivering over 30 years of continuous
innovation Nordson
MARCH is a global leader in plasma processing technology for
manufacturing semiconductors,
printed
circuit boards, microelectronics,
and medical
devices with offices and labs worldwide, including the USA, Europe,
Singapore, China, Japan, and Korea. An expert staff of scientists and
engineers is available to assist development of plasma processes. Visit
Nordson MARCH at www.nordsonmarch.com,
Facebook
or Twitter.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated
products and systems that dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials,
and other fluids, test
and inspect for quality, and treat
and cure surfaces, and are supported by application expertise and
direct global sales and service. Nordson serves many consumer
non-durable, durable and technology end-markets including packaging,
nonwovens, electronics, medical, appliances, energy, transportation,
construction, and general product assembly and finishing. Founded in
1954, headquartered in Westlake, Ohio, Nordson has operations and
support offices in nearly 40 countries. Visit Nordson at www.nordson.com, Twitter
or Facebook.

Contacts

Nordson MARCH (International Headquarters)
Roberta Foster-Smith,
+1.925.827.1240
[email protected]
www.nordsonmarch.com
or
Agency
Contact:
A R Marketing, Inc.
Andrea Roberts, +1.858.204.9584
[email protected]