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Intevac to Participate in the 9th Annual CEO Investor Summit 2017
About The 9th Annual CEO Summit
The CEO Summit is an accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2017 in San Francisco. The event is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration. During the event, investors and analysts will have the opportunity to meet with up to 10 of the 18 management teams during the 30-minute group meeting sessions, as well as opportunities to meet with additional management teams during the breakfast and lunch networking sessions.
The 18 management teams collectively hosting the 2017 CEO Summit include: Aehr Test (AEHR), Axcelis (ACLS), BE Semiconductor Industries (BESI.AS), Brooks (BRKS), Cabot Micro (CCMP), Camtek (CAMT), Cohu (COHU), CyberOptics (CYBE), Electro Scientific (ESIO), FormFactor (FORM), Ichor Systems (ICHR), inTEST (INTT), Intevac (IVAC), Kulicke & Soffa (KLIC), Nanometrics (NANO), Rudolph (RTEC), Soitec (SOIT), and Ultra Clean Technology (UCTT). Sponsoring the networking luncheon is Cowen & Co.
The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is July 7, 2017.
While held concurrently with SEMICON West and Intersolar 2017, the event is not affiliated with the show.
RSVP Contacts for 9th Annual CEO Summit 2017
To RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.
Laura J. Guerrant-Oiye Claire E. McAdams Guerrant Associates Headgate Partners LLC Phone: (808) 960-2642 Phone: (530) 265-9899 Email: [email protected]
Email: [email protected]
About Intevac
Intevac was founded in 1991 and has two businesses: Thin-film Equipment and Photonics.
In our Thin-film Equipment business, we are a leader in the design and development of high-productivity, thin-film processing systems. Our production-proven platforms are designed for high-volume manufacturing of substrates with precise thin film properties, such as the hard drive media, display cover panel, and solar photovoltaic markets we serve currently.
In our Photonics business, we are a recognized leading developer of advanced high-sensitivity digital sensors, cameras and systems that primarily serve the defense industry. We are the provider of integrated digital imaging systems for most U.S. military night vision programs.
For more information call 408-986-9888, or visit the Company's website at www.intevac.com.
ContactsIntevac, Inc.
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James Moniz, 408-986-9888
Chief Financial Officer
or
Claire McAdams, 530-265-9899
Investor Relations
Accredited investor and publishing research analyst event held
concurrently with SEMICON West and Intersolar 2017 in San Francisco
SANTA CLARA, Calif.–(BUSINESS WIRE)–Intevac, Inc. (Nasdaq:IVAC) today announced that company management will
participate in the 9th Annual CEO Investor Summit 2017, taking place
Wednesday, July 12th, in San Francisco, California.
About The 9th Annual CEO Summit
The CEO Summit is an accredited investor and publishing research analyst
event held concurrently with SEMICON West and Intersolar 2017 in San
Francisco. The event is hosted by executive management from
participating companies and will feature a “round-robin” format
consisting of small group meetings, each 30 minutes in duration. During
the event, investors and analysts will have the opportunity to meet with
up to 10 of the 18 management teams during the 30-minute group meeting
sessions, as well as opportunities to meet with additional management
teams during the breakfast and lunch networking sessions.
The 18 management teams collectively hosting the 2017 CEO Summit
include: Aehr Test (AEHR), Axcelis (ACLS), BE Semiconductor Industries
(BESI.AS), Brooks (BRKS), Cabot Micro (CCMP), Camtek (CAMT), Cohu
(COHU), CyberOptics (CYBE), Electro Scientific (ESIO), FormFactor
(FORM), Ichor Systems (ICHR), inTEST (INTT), Intevac (IVAC), Kulicke &
Soffa (KLIC), Nanometrics (NANO), Rudolph (RTEC), Soitec (SOIT), and
Ultra Clean Technology (UCTT). Sponsoring the networking luncheon is
Cowen & Co.
The CEO Investor Summit is by invitation only and is open to accredited
investors and publishing research analysts. As space is limited, please
RSVP early. Hosts reserve the right to limit attendance as necessary.
Last day for registration is July 7, 2017.
While held concurrently with SEMICON West and Intersolar 2017, the event
is not affiliated with the show.
RSVP Contacts for 9th Annual CEO Summit 2017
To RSVP for the CEO Summit, please contact either of the Summit’s
co-chairs.
| Laura J. Guerrant-Oiye | Claire E. McAdams | |||
| Guerrant Associates | Headgate Partners LLC | |||
| Phone: (808) 960-2642 | Phone: (530) 265-9899 | |||
|
Email: [email protected] |
Email: [email protected] |
|||
About Intevac
Intevac was founded in 1991 and has two businesses: Thin-film Equipment
and Photonics.
In our Thin-film Equipment business, we are a leader in the design and
development of high-productivity, thin-film processing systems. Our
production-proven platforms are designed for high-volume manufacturing
of substrates with precise thin film properties, such as the hard drive
media, display cover panel, and solar photovoltaic markets we serve
currently.
In our Photonics business, we are a recognized leading developer of
advanced high-sensitivity digital sensors, cameras and systems that
primarily serve the defense industry. We are the provider of integrated
digital imaging systems for most U.S. military night vision programs.
For more information call 408-986-9888, or visit the Company’s website
at www.intevac.com.
Contacts
Intevac, Inc.
James Moniz, 408-986-9888
Chief Financial Officer
or
Claire
McAdams, 530-265-9899
Investor Relations
