Intevac to Participate in the 6th Annual NYC Investor Summit 2017

SANTA CLARA, Calif.–(BUSINESS WIRE)–Intevac, Inc. (Nasdaq: IVAC), today announced that company management is
scheduled to participate in the 6th Annual NYC Investor Summit 2017,
being held December 6, 2017 at Le Parker Méridien Hotel, New York City.

The presentation material utilized during the NYC Summit will be made
accessible on the investor page of the company’s website at www.intevac.com.

About the 6th Annual NYC Summit

The NYC Summit is hosted by executive management from participating
companies and will feature a “round-robin” format consisting of small
group meetings, each 30 minutes in duration. During the event, investors
and analysts will have the opportunity to meet with up to 10 of the 15
management teams during the 30-minute group meeting sessions, as well as
opportunities to meet with additional management teams during the
breakfast and lunch networking sessions.

The 15 management teams collectively hosting the 2017 NYC Summit
include: Aehr Test (AEHR), Axcelis (ACLS), BE Semiconductor Industries
(BESI.AS), Brooks (BRKS), Camtek (CAMT), Cohu (COHU), Electro Scientific
(ESIO), FormFactor (FORM), Ichor Systems (ICHR), Intermolecular (IMI),
inTEST (INTT), Intevac (IVAC), Kulicke & Soffa (KLIC), Nanometrics
(NANO), and Rudolph Technologies (RTEC). Cowen is sponsoring the
networking luncheon.

The NYC Investor Summit is by invitation only and is open to accredited
investors and publishing research analysts. As space is limited, please
RSVP early. Hosts reserve the right to limit attendance as necessary.
Last day for registration is November 27, 2017.

RSVP Contacts for 6th Annual NYC Summit 2017

To RSVP for the NYC Summit, please contact either of the Summit’s
co-chairs.

About Intevac

Intevac was founded in 1991 and has two businesses: Thin-film Equipment
and Photonics.

In our Thin-film Equipment business, we are a leader in the design and
development of high-productivity, thin-film processing systems. Our
production-proven platforms are designed for high-volume manufacturing
of substrates with precise thin film properties, such as the hard drive
media, display cover panel, and solar photovoltaic markets we serve
currently.

In our Photonics business, we are a recognized leading developer of
advanced high-sensitivity digital sensors, cameras and systems that
primarily serve the defense industry. We are the provider of integrated
digital imaging systems for most U.S. military night vision programs.

For more information call 408-986-9888, or visit the Company's website
at www.intevac.com.

Contacts

Intevac, Inc.
James Moniz, 408-986-9888
Chief Financial Officer
or
Claire
McAdams, 530-265-9899
Investor Relations