Rudolph Technologies Focuses on High Value Solutions for High Growth Markets at SEMICON China

Solutions include inspection, metrology, lithography, probe card test
and software for rapidly growing applications in IoT, AI, FPD and more

SHANGHAI–(BUSINESS WIRE)–Rudolph Technologies, Inc. (NYSE: RTEC) will present a broad portfolio
of innovative solutions for front-end wafer fabrication, advanced
packaging and display manufacturing, during SEMICON
and FPD
China, March 14-16, at the Shanghai New International Expo Centre.

“Rudolph is a prominent exhibitor at this show,” said Vincent Wang,
general manager of Rudolph Technologies China. “We’ll be there in full
force in three different booths, along with our Chinese partners, Simax
AT and Zen Voce Corporations. Rudolph will present a wide array of high
value solutions for many of today’s high growth applications, including:
IoT, AI, AMOLED, and 3D NAND.”

Hall N2 #2655 – Total Process Control for Wafer Fabrication and
Advanced Packaging

Rudolph will highlight total process control for semiconductor
manufacturing and advanced packaging, with solutions for integrated
defect inspection and metrology; defect analysis, classification and
review; and lithography, including:

• Truebump™ Technology on the Dragonfly™ Inspection System – fast,
  accurate and repeatable three-dimensional (3D) metrology for all
  advanced packaging bumping applications, from copper (Cu) pillar, to
  microbumps, and even large C4 bumps.
• Clearfind™ Technology on the Firefly™ Inspection System – detects
  defects that are almost impossible to find using conventional imaging
  techniques – helping to significantly reduce yield-robbing failures in
  both front- and back-end manufacturing processes.
• Yield analysis, data management and defect classification software –
  critical to controlling and improving yield.
• JetStep Lithography Systems – a revolutionary exposure tool
  specifically-designed to meet advanced packaging challenges, including
  the ability to handle a variety of substrate shapes and sizes.

In addition, Rudolph’s Director of Technology Development and
Applications, Priya Mukundhan will present, “Monitoring Critical Process
Steps in 3D NAND and Advanced RF using Picosecond Ultrasonic Metrology,”
at the China
Semiconductor Technology International Conference (CSTIC), Symposium
VI: Metrology, Reliability and Testing, on 12 March.

Hall N2 #2381 – Probe Card Test & Analysis for Semiconductor
Devices

Automated probe card test and repair is used to monitor probe card
health to ensure cards are ready and capable of testing semiconductor
devices. Rudolph’s systems can measure critical card metrics, such as
tip position, tip size, tip planarity, contact resistance, and
electrical continuity.

Hall N1 #1213 – Lithography for Display Manufacturing

Featured products for flat panel display manufacturing include the
JetStep® G45 lithography system, fab-wide yield management
software for intelligent diagnostics, fab-wide fault detection and
classification software and automatic defect classification. Rudolph’s
Vice President of Business Development, Elvino da Silveira, will
present, “A Novel Lithography Approach to Overcome the Next Generation
Flexible AMOLED Production Challenges” at the 2018
China Display Conference Emerging Display Forum on 14 March.

“Consumer demand for high-quality displays is driving rapid adoption of
AMOLED and creating new manufacturing challenges as the industry works
to increase production,” said da Silveira. “We will present our novel
lithography solution for AMOLED panels, which reduces tooling cost and
operating expenses, resulting in superior value of ownership for the
customer.”

For more information about Rudolph’s total process control and
lithography solutions, visit www.rudolphtech.com.

About Rudolph Technologies

Rudolph Technologies, Inc. is a leader in the design, development,
manufacture and support of defect inspection, lithography, process
control metrology, and process control software used by semiconductor
and advanced packaging device manufacturers worldwide. Rudolph delivers
comprehensive solutions throughout the fab with its families of
proprietary products that provide critical yield-enhancing information,
enabling microelectronic device manufacturers to drive down costs and
time to market of their devices. Headquartered in Wilmington,
Massachusetts, Rudolph supports its customers with a worldwide sales and
service organization. Additional information can be found on the
Company’s website at www.rudolphtech.com.

Contacts

Rudolph Technologies, Inc.
Trade Press:
Amy Shay,
+1-952.259.1794
[email protected]
or
Local
office:
Wendy Wang, +86-21-609.306.00
[email protected]